Hybrid Memory Cube RAM
A much faster RAM technology is on the horizon – Hybrid Memory Cube Consortium (consisting of Samsung, Micron, IBM and others) has finalized the specifications of their new approach to memory. Memory bandwidth between different chips is often limited by the relatively far distance the signals have to travel. By stacking memory chips on top of each other, much shorter wires can be used, allowing increasing bandwidth tremendously while reducing the power consumption at the same time.
HMC will use the stacked memory, just like the future Nvidia Volta GPUs. The first version of HMC should offer bandwidth up to 320GB/s, which is over 20 times faster than the fastest DDR3 configurations. HMC Consortium also promises that the first memory using HMC should appear on the market by the end of this year. The costs are unknown at the moment, but it is reasonable to expect that it will come to high performance supercomputers first.